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Volume 8 Issue 8 (August, 2020)

Original Articles

Evaluation of Microshear Bond Strength of Different Generation of Bonding Adhesives Using Two Different Curing Modes- An In Vitro Study
Suksham Johar, Vibha Gupta, Shantun Malhotra, Rajesh Khanna

Aim: To evaluate the Microshear bond strength of two different generation of bonding adhesives using two different curing modalities. An in- vitro study Methods and Material: Sixty non-carious molars were mounted vertically in self-cure acrylic resin 2 mm below Cementoenamel junction. Superficial coronal dentin was exposed by horizontal trimming the occlusal surface of each tooth. The prepared samples were assigned into two groups of 30 each according to the adhesive system used. Total etch (Adper Single bond 2) and self etch (Futurabond DC). Each group subdivided into 15 samples according two curing modes (one sec and 30 sec).The adhesives were applied on dentin surfaces according to the manufacturer’s instructions then composite resin (Filtek Z350 XT, nanocomposite) was condensed through a polyethylene tube with a 1 mm internal diameter and 2 mm height attached firmly to dentin surfaces and light cured. After thermocycling, the samples were stored in distilled water till the adhesive testing using Universal testing machine (Instron) is performed. Statistical analysis used: The µSBS values were expressed in MPa and analyzed with ANOVA and Tukey’s test (P < 0.05). Results: Among the adhesives, Futurabond DC in one second mode showed significantly (P < 0.05) higher µSBS values than Adper Single Bond 2. Conclusions: The universal adhesives will definitely replace all the generations of bonding adhesives because of its numerous advantages over others. The curing using one second mode will be reducing the chair side time and thus the isolation time. Key words: Microshear bond strength, universal adhesives, curing modes.

 
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